Parallel glide: flow of dislocations with internal stress source/sink distribution
Parallel glide: flow of dislocations with internal stress source/sink distribution
Blog Article
The unexpected glide of dislocations on a plane parallel to the film/substrate interface in ultrathin copper films, which has been called parallel glide (Balk et al 2003 Acta Metall.51 Hemorrhoidal 447), is described using an analytical model.The phenomenon is observed as a problem involving inlet/outlet flow from different positions of a grain boundary into the grain channel.
In this sense, parallel glide is presented as the flow Maternity of dislocations with an internal stress source/sink distribution.